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Ascent Circuits Pvt. Ltd.,
Plot No. 111,
Sipcot Industrial Complex,
Phase 1, Hosur - 635126
Tamil Nadu, India

Ph : +91 04344 - 271123 / 271124 
Fax : +91 04344 - 271148
E-mail : info@ascentcircuits.com
               rfq@ascentcircuits.com

 
 
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Home     >     Our Products    
 
 
  • Single Side PCB
 
pcb
   
Material :

XPC, FR1, FR2, CEM1, CEM3, FR4

Finish :

Lacquer, OSP (Glicoat F2) HAL, Lead FREE HAL, Electrolytic Gold,
Immersion Gold, Nickel Plating, Silver Jumpers

Technology :

CNC Routing & Punching

   
 
  • Double Side PCB
 
pcb
   
Material :

FR4, CEM3,

Finish :

Lacquer, OSP (Glicoat F2) HAL, Lead FREE HAL, Electrolytic Gold,
Immersion Gold, Nickel Plating, Silver Jumpers

Technology :

CNC routing and Blanking

   
 
 
  • Multilayer PCB
 
pcb
   
Material :

FR4, High Tg material, and others available

Finish :

HAL, Lead FREE HAL, Immersion Gold

Technology :

Up to 8 layers

   
 

Below is a summary over our current capability/capacity for standard mass production. We can also meet special requirement for your products upon request.

 
   
Layer Count  :

1 - 12

Board Thickness :

(Min      /   Max)     

Single Sided :

0.4 mm / 2.4 mm

Double Sided (PTH) :

0.4 mm / 3.2 mm

4 Layer :

0.6 mm / 3.2 mm

6 Layer :

0.8 mm / 3.2 mm

Base Laminate Copper Weight :

17 um to 105 um

Base Laminate Type :

XPC, FR1, FR2, CEM1, CEM3, FR4

Minimum Line Width / Space :

0.13 mm / 0.10 mm

   
Minimum Hole Size (Finished) :
 
Punching Holes :

0.7 mm

CNC Drilled non plated :

0.3 mm

CNC Drilled plated :

0.25 mm

Aspect Ratio :

14

Minimun Annular Ring Size : 

0.25 mm greater than hole size

   
Finished Board Size
 
Maximum :

576x424mm

   
 
   
HASL  :

YES

OSP (Glicoat F2 or Lacquer) :

YES  

Electrolytic Gold :

YES

Gold Finger :

YES

Immersion Gold :

YES

Others :

Upon Special Request

   
 

Production Capacity per Month

   
Single Sided  :

45,000 m2

Double Sided PTH :

4,000 m2

Multi Layer :

5,000 m2