Ascent Circuits

MULTI-LAYER PCBs

4 Layer (Automotive - IBU)
4 Layer (Automotive)
4 Layer (Telecom - Teflon based 5G Application)
16 Layer (Space Application)
18 Layer (Telecom)

MULTI-LAYER PCBs

4 Layer (Automotive - IBU)
4 Layer (Automotive)
4 Layer (Telecom - Teflon based 5G Application)
16 Layer (Space Application)
18 Layer (Telecom)

Overview

Meet business goals with our best-in-class Multi-Layer PCBs designed and manufactured to deliver extraordinary levels of performance. We manufacture Mid-Large volume Multi-Layer PCBs, starting from 25 sq.mtr upto any volume. Our Multi-Layer PCBs are highly reliable with Class 2 & Class 3 Standards.

Applications: Automotive, Telecom, IoT, Space & Defence, etc.

Production Capacity: 12,000 m2 (Per Month)

Materials: FR4, PTFE, Hybrid (Ceramic Composite Material + FR4) (130 Tg, 150 Tg & 180 Tg)

Surface Finish: OSP, HASL, LF HASL, ENIG, Hard Gold, Immersion Tin, Electrolytic Tin, Selective Finishes

Solder Mask Color: Green, Blue & Black

Business Enquiry Form

Kindly fill in the form below,
our team will connect with you shortly!

* Required Fields

#ConnectingFuture